The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2009

Filed:

May. 24, 2005
Applicants:

Chang Sup Ryu, Daejeon, KR;

Doo Hwan Lee, Chungcheongbuk-do, KR;

Jin Yong Ahn, Daejeon, KR;

Myung Sam Kang, Daejeon, KR;

Suk Hyeon Cho, Daejeon, KR;

Inventors:

Chang Sup Ryu, Daejeon, KR;

Doo Hwan Lee, Chungcheongbuk-do, KR;

Jin Yong Ahn, Daejeon, KR;

Myung Sam Kang, Daejeon, KR;

Suk Hyeon Cho, Daejeon, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Kyunggi-do. Korea, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.


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