The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2009

Filed:

May. 16, 2006
Applicants:

Lianzhong Yu, Redmond, WA (US);

Ken L. Yang, Bellevue, WA (US);

Inventors:

Lianzhong Yu, Redmond, WA (US);

Ken L. Yang, Bellevue, WA (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A MEMS device having a proof mass resiliently mounted above a substrate has projections formed on adjacent surfaces of the mass and substrate. The device is formed by creating a plurality of holes in the upper layer. A substance suitable for removing the intermediate layer without substantially removing the upper layer and substrate is introduced through the holes. A substance removing the upper layer, the substrate, or both, is then introduced through the holes to remove a small amount of the substrate and upper layer. Portions of the intermediate layer between the projections are then removed. The dimple structure fabricated from this process will prevent MEMS device stiction both in its final release and device operation.


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