The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Nov. 07, 2003
Akihiro Kawase, Kasugai, JP;
Toshihiro Miwa, Aichi, JP;
Kenji Sakamoto, Gifu, JP;
Ichiro Hayashida, Iruma, JP;
Akihiro Kawase, Kasugai, JP;
Toshihiro Miwa, Aichi, JP;
Kenji Sakamoto, Gifu, JP;
Ichiro Hayashida, Iruma, JP;
Wako Pure Chemical Industries, Ltd, Osaka, JP;
Abstract
A polishing composition and a rinsing composition according to the present invention can effectively suppress wafer contamination caused by metal impurities. The polishing composition includes a chelating agent, an alkali compound, silicon dioxide and water. The rinsing composition includes a chelating agent, an alkali compound and water. The chelating agent contained in the polishing composition and the rinsing composition is an acid represented by the following chemical formula (1) or a salt thereof. In the chemical formula (1), each of Yand Yrepresents an alkylene group, n is an integer of 0 to 4, each of 4+n substituents represented by Rto Ris an alkyl group. At least four of the alkyl groups have a phosphonic acid group.