The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2009

Filed:

Jan. 06, 2006
Applicants:

John A. Fitzsimmons, Poughkeepsie, NY (US);

William J. Cote, Poughquag, NY (US);

Nancy A. Greco, LaGrangeville, NY (US);

Thomas H. Ivers, Hopewell Junction, NY (US);

Steven Moskowitz, Poughkeepsie, NY (US);

Inventors:

John A. Fitzsimmons, Poughkeepsie, NY (US);

William J. Cote, Poughquag, NY (US);

Nancy A. Greco, LaGrangeville, NY (US);

Thomas H. Ivers, Hopewell Junction, NY (US);

Steven Moskowitz, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods for forming conductor contacts provide for etching through a capping layer located upon a conductor contact region within a substrate. A first pair of methods provide for etching through at least a lower thickness of the capping layer with other than a reactive ion etch to provide an exposed conductor contact region. A partially overlapping second pair of methods provides for converting at least an upper thickness of the capping layer to a converted material layer that is removed incident to providing an exposed conductor contact region. As adjunct to any of the methods, a liner layer is formed and located upon the exposed conductor contact region in absence of an undesirable reactive environment.


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