The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7480144 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 20, 2009

Filed:

Nov. 03, 2006
Applicant:

Dong-yun LI, Shenzhen, CN;

Inventor:

Dong-Yun Li, Shenzhen, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation device includes a retention module () and a heat sink () both mounted on the printed circuit board (). The retention module forms a pair of opposite fixture blocks () thereon. The heat sink received in the retention module has protective hollow sleeves () positioned corresponding to the blocks. Each sleeve has a supporting pad () therein. A pair of braces () each extend through the sleeve and comprise a baffle portion () located above the pad and a fastening portion () below a bottom end of the sleeve. A spring () is compressed between the baffle portion of the brace and the pad of each of the sleeves. The fastening portions of the braces securely fasten the blocks of the retention module after the first springs are stretched a distance with an upward movement of the braces.


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Li, Dong-Yun. (2009). Heat dissipation device (U.S. Patent No. 7480144). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7480144

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