The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
May. 11, 2006
Applicant:
Tadashi Iijima, Kawasaki, JP;
Inventor:
Tadashi Iijima, Kawasaki, JP;
Assignee:
Toshiba America Electronic Components, Inc., Irvine, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device and a method for making the semiconductor device having a barrier layer in a via hole region and a barrier layer in a via line region. The barrier layer in the via line region is initially thicker than the barrier layer in the via hole region, prior to being etched during an etching process due to varying selectivity of etching rates between the via hole region and the via line region.