The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2009

Filed:

Aug. 10, 2004
Applicants:

Hiroyuki Isobe, Yanai, JP;

Gen Murakami, Tokyo, JP;

Toshikatsu Hiroe, Yonezawa, JP;

Inventors:

Hiroyuki Isobe, Yanai, JP;

Gen Murakami, Tokyo, JP;

Toshikatsu Hiroe, Yonezawa, JP;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/267 (2006.01); H01L 29/06 (2006.01); H01L 31/0328 (2006.01); H01L 31/0336 (2006.01); H01L 31/072 (2006.01); H01L 31/109 (2006.01); H01L 27/15 (2006.01); H01L 29/22 (2006.01); H01L 33/00 (2006.01); H01L 29/227 (2006.01); H01L 29/24 (2006.01); H01L 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light emitting device has a cup portion with a bottom surface opening, and one electrode of a light emitting element is connected to the cup portion. The other electrode of the light emitting element is connected to a lead set up from an inner space to outside the cup portion using the opening of the cup portion. Each electrode and lead of the light emitting device can be electrically connected without bonding wires. This prevents shadows or light unevenness from reflecting the shape of the bonding wire, thereby enhancing light-emission efficiency. As an alternative to setting up the lead from inside to the outside of the cup portion, the lead existing outside the cup portion and the other electrode are electrically connected via the bonding wire through the cup portion's opening. Thus, light outputted outside of the light emitting device is not intercepted by the bonding wire.


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