The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Oct. 30, 2003
Takayuki Saito, Fujisawa, JP;
Tsukuru Suzuki, Fujisawa, JP;
Kaoru Yamada, Fujisawa, JP;
Kenya Ito, Tokyo, JP;
Masayuki Kamezawa, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Takayuki Saito, Fujisawa, JP;
Tsukuru Suzuki, Fujisawa, JP;
Kaoru Yamada, Fujisawa, JP;
Kenya Ito, Tokyo, JP;
Masayuki Kamezawa, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a processing liquid supply unit for supplying a processing liquid onto a peripheral portion of the substrate which is being rotated in such a manner that the processing liquid is stationary with respect to the substrate. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder for holding a substrate substantially horizontally and rotating the substrate, and a cleaning liquid supply unit having a cleaning liquid outlet which is oriented from a center of the substrate toward a peripheral portion of the substrate with an elevation angle of not more than 45° from a surface of the substrate. The cleaning liquid supply unit supplies a cleaning liquid to the surface of the substrate at a flow velocity of not less than 0.1 m/s.