The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Dec. 06, 2006
Wei-chang Tai, Kaohsiung, TW;
Chi-chih Chu, Kaohsiung, TW;
Meng-jung Chuang, Kaohsiung, TW;
Cheng-yin Lee, Kaohsiung, TW;
Yao-ting Huang, Kaohsiung, TW;
Kuang-lin Lo, Kaohsiung, TW;
Wei-Chang Tai, Kaohsiung, TW;
Chi-Chih Chu, Kaohsiung, TW;
Meng-Jung Chuang, Kaohsiung, TW;
Cheng-Yin Lee, Kaohsiung, TW;
Yao-Ting Huang, Kaohsiung, TW;
Kuang-Lin Lo, Kaohsiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.