The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Dec. 23, 2005
Rajit Chandra, Cupertino, CA (US);
Rajit Chandra, Cupertino, CA (US);
Gradient Design Automation Inc., Santa Clara, CA (US);
Abstract
A thermally aware design automation suite integrates system-level thermal awareness into the design of semiconductor chips. A thermal analysis engine performs fine-grain thermal simulations of the semiconductor chip based on thermal models and boundary conditions for all thermally significant structures in the chip and the adjacent system that impact the temperature of the semiconductor chip. The thermally aware design automation suite uses the simulations of the thermal analysis engine to repair or otherwise modify the thermally significant structures to equalize temperature variations across the chip, impose specified design assertions on selected portions of the chip, and verify overall chip performance and reliability over designated operating ranges and manufacturing variations. The thermally significant structures are introduced or modified via one or more of: change in number, change in location, and change in material properties.