The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Jun. 30, 2006
Tai-chun Huang, Hsinchu, TW;
Chih-hsiang Yao, Taipei, TW;
Chin-chiu Hsia, Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A semiconductor device includes a substrate with a dielectric layer thereon, a stack of interconnection structures in the dielectric layer, each interconnection structure including a conductive layer and a layer of plugs connecting the conductive layer, at least a layer of plugs including a crack stopper, and a bonding pad structure with a predetermined bump area thereon, overlying the stack of interconnection structures, wherein the crack stopper is formed along an edge of a projection area corresponding to the predetermined bump area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile