The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Feb. 22, 2005
Tetsuo Shimomura, Osaka, JP;
Atsushi Kazuno, Osaka, JP;
Kazuyuki Ogawa, Osaka, JP;
Yoshiyuki Nakai, Osaka, JP;
Masahiko Nakamori, Ohtsu, JP;
Takatoshi Yamada, Ohtsu, JP;
Tetsuo Shimomura, Osaka, JP;
Atsushi Kazuno, Osaka, JP;
Kazuyuki Ogawa, Osaka, JP;
Yoshiyuki Nakai, Osaka, JP;
Masahiko Nakamori, Ohtsu, JP;
Takatoshi Yamada, Ohtsu, JP;
Toyo Tire & Rubber Co., Ltd., Osaka, JP;
Abstract
The present invention provides a polishing pad which imparts excellent planarity and uniformity thereof to a material to be polished, such as a semiconductor wafer, without forming scratches. The present invention relates to a semiconductor wafer polishing pad comprising a polishing layer and a cushion layer, wherein the polishing layer is formed from foamed polyurethane, has a flexural modulus of 250 to 350 MPa, the cushion layer is formed from closed-cell foam and has a thickness of 0.5 to 1.0 mm and a strain constant of 0.01 to 0.08 μm/(gf/cm).