The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Feb. 22, 2005
Tetsuji Ishikawa, Kawasaki, JP;
Osamu Saitou, Kawasaki, JP;
Masakazu Kobayashi, Kawasaki, JP;
Hideaki Terauchi, Kawasaki, JP;
Tetsuji Ishikawa, Kawasaki, JP;
Osamu Saitou, Kawasaki, JP;
Masakazu Kobayashi, Kawasaki, JP;
Hideaki Terauchi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.