The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
Mar. 06, 2007
Leland Szewerenko, Austin, TX (US);
Paul Goodwin, Austin, TX (US);
James Douglas Wehrly, Jr., Austin, TX (US);
Leland Szewerenko, Austin, TX (US);
Paul Goodwin, Austin, TX (US);
James Douglas Wehrly, Jr., Austin, TX (US);
Entorian Technologies, LP, Austin, TX (US);
Abstract
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.