The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
May. 13, 2003
Applicants:
Mou-shiung Lin, Hsinchu, TW;
Bryan Peng, Taoyuan, TW;
Inventors:
Mou-Shiung Lin, Hsinchu, TW;
Bryan Peng, Taoyuan, TW;
Assignee:
Megica Corporation, Hsin-Chu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections, locating a suspended semiconductor chip within the window, and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip-on-chip connection. A bypass capacitor is formed on the printed circuit board.