The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2008

Filed:

Dec. 03, 2007
Applicants:

Takahiro Osawa, Kodaira, JP;

Yoichi Kawata, Higashiyamato, JP;

Atsushi Fujishima, Kodaira, JP;

Tamaki Wada, Higashimurayama, JP;

Kenichi Imura, Higashiyamato, JP;

Inventors:

Takahiro Osawa, Kodaira, JP;

Yoichi Kawata, Higashiyamato, JP;

Atsushi Fujishima, Kodaira, JP;

Tamaki Wada, Higashimurayama, JP;

Kenichi Imura, Higashiyamato, JP;

Assignees:

Renesas Technology Corp., Kodaira-shi, JP;

Hitachi ULSI Systems, Co., Ltd., Kodaira-shi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.


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