The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7463491 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 09, 2008

Filed:

Feb. 16, 2007
Applicants:

Hiroshi Yamada, Yokohama, JP;

Keiji Takaoka, Kawasaki, JP;

Hideto Furuyama, Yokohama, JP;

Inventors:

Hiroshi Yamada, Yokohama, JP;

Keiji Takaoka, Kawasaki, JP;

Hideto Furuyama, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board includes a core composite layer having first and second core boards and an optical transmission portion; first electrodes disposed on one part of the core composite layer, being adapted to mount an optical semiconductor module on the core composite layer; upper and lower core board wirings disposed on another part of and beneath the core composite layer; and upper and lower build-up wirings stacked on the upper and lower core board wirings, being adapted to mount semiconductor modules.


Find Patent Forward Citations

Yamada, Hiroshi. (2008). Wiring board and a semiconductor device using the same (U.S. Patent No. 7463491). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7463491

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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