The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2008

Filed:

Dec. 17, 2004
Applicants:

Jens Pohl, Bernhardswald, DE;

Bernd Roemer, Bernhardswald, DE;

Bernhard Schaetzler, Regensburg, DE;

Christian Stuempfl, Schwandorf, DE;

Herman Vilsmeier, Karlsfeld, DE;

Holger Woerner, Regensburg, DE;

Bernhard Zuhr, Regensburg, DE;

Inventors:

Jens Pohl, Bernhardswald, DE;

Bernd Roemer, Bernhardswald, DE;

Bernhard Schaetzler, Regensburg, DE;

Christian Stuempfl, Schwandorf, DE;

Herman Vilsmeier, Karlsfeld, DE;

Holger Woerner, Regensburg, DE;

Bernhard Zuhr, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.


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