The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Feb. 22, 2006
Yonggill Lee, Kaoshiung, TW;
Kwangwon Koh, Kaoshiung, TW;
Sangyun Lee, Kaoshiung, TW;
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Abstract
A packaging method for segregating die paddles of a leadframe, includes (a) providing a leadframe having a top surface, a bottom surface and a die paddle region, the die paddle region having a plurality of die paddles, wherein at least two of the die paddles are connected to each other by at least one connecting bar; (b) attaching a plurality of dies onto the die paddles; (c) forming a molding compound to encapsulate the dies on the die paddles, and exposing the bottom surface of the connecting bar outside the molding compound; and (d) removing part of the connecting bar so as to segregate the die paddles. The die paddles are thus rendered stable during the steps of die attaching, wire bonding and molding, and the yield is raised.