The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Dec. 08, 2006
Barry W. Eppler, Berthoud, CO (US);
Barry W. Eppler, Berthoud, CO (US);
Verigy (Singapore) Pte. Ltd., Singapore, SG;
Abstract
In one embodiment, an interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly. Each conductive contact pad has a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is also disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps.