The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Dec. 11, 2006
Charles Gerard Woychik, Niskayuna, NY (US);
Rayette Ann Fisher, Niskayuna, NY (US);
David Martin Mills, Niskayuna, NY (US);
Scott Cogan, Niskayuna, NY (US);
David Richard Esler, Mayfield, NY (US);
Robert Gideon Wodnicki, Niskayuna, NY (US);
Jeffrey Scott Erlbaum, Albany, NY (US);
Charles Gerard Woychik, Niskayuna, NY (US);
Rayette Ann Fisher, Niskayuna, NY (US);
David Martin Mills, Niskayuna, NY (US);
Scott Cogan, Niskayuna, NY (US);
David Richard Esler, Mayfield, NY (US);
Robert Gideon Wodnicki, Niskayuna, NY (US);
Jeffrey Scott Erlbaum, Albany, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.