The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Mar. 03, 2006
Lyudmila Zaykova-feldman, Dallas, TX (US);
Thomas M. Moore, Dallas, TX (US);
Lyudmila Zaykova-Feldman, Dallas, TX (US);
Thomas M. Moore, Dallas, TX (US);
Omniprobe, Inc., Dallas, TX (US);
Abstract
An apparatus for testing flip-chip packages has a programmed computer, a test-engine stage for applying an impact to at least one package under test, and a monitoring stage. The test-engine stage causes an impact on the package on the side opposite its ball-grid array. The test-engine stage has actuators connected to the test-engine stage and the computer, for moving and aligning the test-engine stage. The monitoring stage has a digital camera connected to the computer for transmitting digital images from the ball-grid array side of the package to the computer. A microscope is preferably connected to the digital camera. A sample stage located between the test-engine stage and the monitoring stage holds the package under test. The sample stage has an acoustic transducer capable of being removably connected to the package under test. The acoustic transducer is connected to the computer for transmitting signals from the acoustic transducer to the computer.