The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Dec. 16, 2005
Applicants:
Bongsuk Choi, Kyoungki-do, KR;
Jae Han Chung, Kyoungki-do, KR;
Keon Teak Kang, Kyoungki-do, KR;
Inventors:
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stacked integrated circuits package system is provided providing a first substrate, mounting a first integrated circuit on a second substrate, attaching the first integrated circuit, by a side opposite the second substrate, to the first substrate, mounting a second integrated circuit to the second substrate, connecting the second integrated circuit to the first substrate, and attaching a heat spreader to the second integrated circuit and the first substrate.