The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Sep. 29, 2006
Heiko Weichert, Utzberg, DE;
Kirsten Ruck, Dresden, DE;
Heiko Weichert, Utzberg, DE;
Kirsten Ruck, Dresden, DE;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A method of heat-treating resist coated manufacturing wafers in a processing system by establishing a temperature profile for each of a plurality of hotplates in the processing system, heat-treating the resist coated manufacturing wafers on the hotplates, obtaining CD metrology data from test areas on the heat-treated resist coated manufacturing wafers, determining CD variations for each hotplate from the CD metrology data, adjusting the temperature profile of one or more hotplates after determining the CD variations, and heat-treating additional resist coated manufacturing wafers on the hotplates after the adjusting.