The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Jul. 12, 2007
Shi-wen Zhou, Shenzhen, CN;
Chun-chi Chen, Taipei Hsien, TW;
Guo Chen, Shenzhen, CN;
Fu Zhun Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device comprises a first heat sink () for thermally contacting with an electronic device, a second heat sink () mounted on the first heat sink, heat pipes () connecting with both the first and second heat sinks. The heat pipes surround an entire periphery of the first heat sink and a part of the second heat sink. Each heat pipe comprises an evaporating portion (), a first condensing portion () and a second condensing portion (). The first and second condensing portions extend from two opposite ends of the evaporating portion respectively. The evaporating portion is positioned adjacent to the electronic device and the two condensing portions extend inwardly and bend in opposite directions to each other. The first condensing portion extends through the first heat sink and the second condensing portion extends through the second heat sink.