The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Oct. 04, 2005
Applicants:
Toshihiro Iwasaki, Tokyo, JP;
Michitaka Kimura, Tokyo, JP;
Kozo Harada, Tokyo, JP;
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.