The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2008

Filed:

Feb. 09, 2006
Applicants:

Lucille A. Giannuzzi, Orlando, FL (US);

Paul Anzalone, Merrimack, NH (US);

Richard Young, Beaverton, OR (US);

Daniel W. Phifer, Jr., Chelsea, MA (US);

Inventors:

Lucille A. Giannuzzi, Orlando, FL (US);

Paul Anzalone, Merrimack, NH (US);

Richard Young, Beaverton, OR (US);

Daniel W. Phifer, Jr., Chelsea, MA (US);

Assignee:

FEI, Company, Hillsboro, OR (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 23/00 (2006.01); G21K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of sample extraction entails making multiple, overlapping cuts using a beam, such as a focused ion beam, to create a trench around a sample, and then undercutting the sample to free it. Because the sidewalls of the cut are not vertical, the overlapping cuts impinge on the sloping sidewalls formed by previous cuts. The high angle of incidence provides a greatly enhanced mill rate, so that making multiple overlapping cuts to produce a wide trench can requires less time than making a single, deep cut around the perimeter of a sample.


Find Patent Forward Citations

Giannuzzi, Lucille. (2008). Repetitive circumferential milling for sample preparation (U.S. Patent No. 7442924). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7442924

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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