The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Oct. 05, 2006
William E. Bernier, Endwell, NY (US);
Marie S. Cole, Wappingers Falls, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Tasha E. Lopez, Santa Ana, CA (US);
Roger A. Quon, Rhinebeck, NY (US);
David J. Welsh, Salt Point, NY (US);
William E. Bernier, Endwell, NY (US);
Marie S. Cole, Wappingers Falls, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
John U. Knickerbocker, Wappingers Falls, NY (US);
Tasha E. Lopez, Santa Ana, CA (US);
Roger A. Quon, Rhinebeck, NY (US);
David J. Welsh, Salt Point, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.