The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2008

Filed:

Sep. 18, 2006
Applicants:

Gen Pei, Yorktown Heights, NY (US);

Scott D. Luning, Poughkeepsie, NY (US);

Johannes Van Meer, Newburgh, NY (US);

Inventors:

Gen Pei, Yorktown Heights, NY (US);

Scott D. Luning, Poughkeepsie, NY (US);

Johannes van Meer, Newburgh, NY (US);

Assignee:

Advanced Micro Devices, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stress enhanced CMOS circuit and methods for its fabrication are provided. One fabrication method comprises the steps of forming an NMOS transistor and a PMOS transistor adjacent the NMOS transistor in a channel width direction, the PMOS transistor and the NMOS transistor separated by an isolation region. A compressive stress liner is deposited overlying the transistors and the isolation region and is etched to remove the compressive stress liner from the NMOS transistor and from a portion of the isolation region. A tensile stress liner is deposited overlying the transistors, the isolation region, and the compressive stress liner and is etched to remove a portion of the tensile stress liner overlying a portion of the compressive stress liner and to leave the tensile stress liner overlying the NMOS transistor, the isolation region, and a portion of the compressive stress liner.


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