The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2008

Filed:

Apr. 11, 2006
Applicants:

Toshinori Fukai, Kanagawa, JP;

Akihito Sakakidani, Kanagawa, JP;

Inventors:

Toshinori Fukai, Kanagawa, JP;

Akihito Sakakidani, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of manufacturing a semiconductor device includes: forming a substrate protection film to cover an n-type FET forming region having a first gate electrode and a p-type FET forming region having a second gate electrode; opening the p-type FET forming region by patterning a resist film after the resist film is formed to cover the n-type FET and p-type FET forming regions; exposing the surface of the semiconductor substrate by selectively removing the substrate protection film in the p-type FET forming region, leaving the film only on side walls of the second gate electrode; forming a pair of p-type extension regions at both sides of the second gate electrode, by doping impurities to the semiconductor substrate, with the resist film, the second gate electrode, and the substrate protection film formed on side walls of the second electrode; and removing the resist film formed on the n-type FET forming region.


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