The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Jun. 07, 2002
Toshihiro Higuchi, Tokyo, JP;
Shotaro Nagaike, Kanagawa, JP;
Taku Yamada, Kanagawa, JP;
Yoji Inomata, Kanagawa, JP;
Toshihiro Higuchi, Tokyo, JP;
Shotaro Nagaike, Kanagawa, JP;
Taku Yamada, Kanagawa, JP;
Yoji Inomata, Kanagawa, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A portable electronic device in which microswitches () controlled by operation buttons () are mounted on one side of a printed circuit board (), and circuit elements accommodated in BGA packages (), () and () are soldered on the other side of the printed circuit board. In the portable electronic device, a shield wall () for surrounding the BGA packages (), () and () is mounted on the printed circuit board (), a first protrusion portion () for holding down the shield wall () on the printed circuit board () is protruded from a case () of the portable electronic device (), and second protrusion portion () for holding down surfaces of the BGA packages (); () and () on the printed circuit board () is protruded from the case () of the portable electronic device (). With such a construction, the BGA packages are prevented from being peeled off from the printed circuit board (). Further, even when the push buttons are frequently depressed in playing a game, the soldering parts of the BGA packages mounted on the back side of the operation button can be maintained in good conditions.