The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Mar. 14, 2007
Jongwoo Ha, Seoul, KR;
Taebok Jung, Seoul, KR;
Jongwoo Ha, Seoul, KR;
Taebok Jung, Seoul, KR;
Chippac, Inc., Fremont, CA (US);
Abstract
A multichip package has a leadframe including peripheral leads arranged about a centrally situated die paddle. A first die is attached to a first side of the leadframe die paddle. The second side of the leadframe is partially cut away so that an outer part of the die paddle is thinner, and an inner part of the leads is thinner. These partially cutaway portions in the second side of the leadframe provide a cavity, in which a second die is attached active side upward. The lower die may have bond pads near the center of the active surface, and electrical interconnection of the lower die may be made by wire bonds running through the gap between the die paddle and the leads; or, the lower die may be attached, and electrically interconnected, by flip chip interconnect to the die attach side of the cavity in the leadframe.