The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7435074 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 14, 2008

Filed:

Mar. 13, 2004
Applicants:

Matthew E. Colburn, Hopewell Junction, NY (US);

Kenneth Raymond Carter, San Jose, CA (US);

Gary M. Mcclelland, Palo Alto, CA (US);

Dirk Pfeiffer, Dobbs Ferry, NY (US);

Inventors:

Matthew E. Colburn, Hopewell Junction, NY (US);

Kenneth Raymond Carter, San Jose, CA (US);

Gary M. McClelland, Palo Alto, CA (US);

Dirk Pfeiffer, Dobbs Ferry, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C29C 59/02 (2006.01); C03C 17/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds.


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Colburn, Matthew. (2008). Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning (U.S. Patent No. 7435074). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7435074

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