The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Dec. 22, 2004
Applicant:
Alexei Sheydayi, Gilbert, AZ (US);
Inventor:
Alexei Sheydayi, Gilbert, AZ (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
An isolated semiconductor wafer platen is disclosed for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is well known in the art and can be applied to high pressure systems as well, but some difficulties can arise under high pressure processes. Small deflections in even very thick metal support platens can lead to backside wafer wear, platen abrasion, and even breakage of semiconductor wafers. This invention discloses a method to eliminate the transfer of flexure inherent in high pressure vessel walls, yet still retain the vacuum chucking method.