The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7433187 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 07, 2008

Filed:

Mar. 24, 2004
Applicants:

Takahiro Ishikawa, Toyoake, JP;

Masayuki Shinkai, Ama-Gun, JP;

Makoto Miyahara, Nagoya, JP;

Shuhei Ishikawa, Handa, JP;

Nobuaki Nakayama, Obu, JP;

Seiji Yasui, Handa, JP;

Inventors:

Takahiro Ishikawa, Toyoake, JP;

Masayuki Shinkai, Ama-Gun, JP;

Makoto Miyahara, Nagoya, JP;

Shuhei Ishikawa, Handa, JP;

Nobuaki Nakayama, Obu, JP;

Seiji Yasui, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat spreader module has a pedestal, a heat spreader member joined to the pedestal by a first active hard brazing material, an intermediate layer joined to the heat spreader member by a second active hard brazing material, an insulating board joined to the intermediate layer by a third active hard brazing material, and a circuit board joined to the insulating board by a fourth active hard brazing material. The first through fourth active hard brazing materials are supplied such that the active hard brazing materials have a thickness ranging from 3 to 20 μm when the components of the heat spreader module are joined together under pressure, and contain an active element in an amount ranging from 400 to 1000 μg/cm.


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