The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2008

Filed:

May. 05, 2004
Applicants:

Seiichiro Okuda, Kyoto, JP;

Hiroaki Sugimoto, Kyoto, JP;

Takuya Kuroda, Kyoto, JP;

Masanobu Sato, Kyoto, JP;

Sadao Hirae, Kyoto, JP;

Shuichi Yasuda, Kyoto, JP;

Kenya Morinishi, Kyoto, JP;

Masayoshi Imai, Kyoto, JP;

Inventors:

Seiichiro Okuda, Kyoto, JP;

Hiroaki Sugimoto, Kyoto, JP;

Takuya Kuroda, Kyoto, JP;

Masanobu Sato, Kyoto, JP;

Sadao Hirae, Kyoto, JP;

Shuichi Yasuda, Kyoto, JP;

Kenya Morinishi, Kyoto, JP;

Masayoshi Imai, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.


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