The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7428153 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 23, 2008

Filed:

Jul. 13, 2006
Applicants:

Li-kuang Tan, Tu-Cheng, TW;

Yeu-lih Lin, Tu-Cheng, TW;

Tseng-hsiang HU, Tu-Cheng, TW;

Inventors:

Li-Kuang Tan, Tu-Cheng, TW;

Yeu-Lih Lin, Tu-Cheng, TW;

Tseng-Hsiang Hu, Tu-Cheng, TW;

Assignee:

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipation assembly used for dissipating heat from heat generating electronic components includes a mounting frame, a heat sink and a fan duct. The heat sink is positioned on the mounting frame; the fan duct is attached to the heat sink. The fan duct includes a plurality of first clamping portions, and the mounting frame includes a plurality of second clamping portions corresponding to the first clamping portions. The first clamping portions engage with the second clamping portions to fix the fan duct and the heat sink onto the mounting frame.


Find Patent Forward Citations

Tan, Li-Kuang. (2008). Heat dissipation assembly (U.S. Patent No. 7428153). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7428153

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