The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2008

Filed:

Dec. 09, 2005
Applicants:

Tong-hua Lin, Guangdong, CN;

Chin-lung Chen, Guangdong, CN;

Yeu-lih Lin, Guangdong, CN;

Da-chang Chou, Guangdong, CN;

Inventors:

Tong-Hua Lin, Guangdong, CN;

Chin-Lung Chen, Guangdong, CN;

Yeu-Lih Lin, Guangdong, CN;

Da-Chang Chou, Guangdong, CN;

Assignees:

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Longhua Town, Bao'an District, Shenzhen, Guangdong Province, CN;

Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat dissipating apparatus () includes a base (), a plurality of stacked fins (), and at least a heat pipe (). The base absorbs heat from a heat-generating component. Each of the fins includes a main body (), and a plurality of projection members () extending from the main body. The projection members of a first fin connect the projection members of a second fin. The projection members form a first heat transfer path for transferring heat from the base to the fins. The heat pipe includes a heat-absorbing portion () thermally contacting with the base, and a heat-dissipating portion () contacting with the fins. The heat pipe forms a second heat transfer path for transferring the heat from the base toward the fins.


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