The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Nov. 26, 2003
Viraj A. Patwardhan, Sunnyvale, CA (US);
Hau Nguyen, San Jose, CA (US);
Nikhil K. Kelkar, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
Viraj A. Patwardhan, Sunnyvale, CA (US);
Hau Nguyen, San Jose, CA (US);
Nikhil K. Kelkar, San Jose, CA (US);
Shahram Mostafazadeh, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after solder bumps have been added but prior to dicing. This support coating or underfill layer provides added strength to the eventual reflowed solder connections, such that the operational lifetime of these connections is increased with respect to failure due to temperature cycling.