The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2008

Filed:

May. 23, 2005
Applicants:

Katsuo Kawaguchi, Gifu, JP;

Hirofumi Futamura, Gifu, JP;

Yukinobu Mikado, Gifu, JP;

Sotarou Ito, Gifu, JP;

Inventors:

Katsuo Kawaguchi, Gifu, JP;

Hirofumi Futamura, Gifu, JP;

Yukinobu Mikado, Gifu, JP;

Sotarou Ito, Gifu, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof, and the rigid substrate including a conductive layer having interconnecting electrode pads provided on at least one surface thereof in a position opposite to the interconnecting electrode pads on the rigid substrate, are locally connected electrically to each other with an anisotropic conductive adhesive layer interposed between conductive layers of substrate portions each including at least the interconnecting electrode pads.


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