The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2008
Filed:
May. 25, 2006
Applicants:
Meng-jung Chuang, Kao-Hsiung, TW;
Cheng-yin Lee, Tai-Nan, TW;
Wei-chang Tai, Kao-Hsiung, TW;
Chi-chih Chu, Kao-Hsiung, TW;
Inventors:
Meng-Jung Chuang, Kao-Hsiung, TW;
Cheng-Yin Lee, Tai-Nan, TW;
Wei-Chang Tai, Kao-Hsiung, TW;
Chi-Chih Chu, Kao-Hsiung, TW;
Assignee:
Advanced Semiconductor Engineering, Inc., Kao-Hsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A system-in-package structure includes a carrier substrate having a molding area and a periphery area, at least a chip disposed in the molding area, an encapsulation covering the chip and the molding area, a plurality of solder pads disposed in the periphery area, and a solder mask disposed in the periphery area and partially exposing the surface of the solder pads. The solder mask includes at least a void therein.