The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2008
Filed:
Dec. 21, 2004
Applicants:
Masayuki Furumiya, Kanagawa, JP;
Ryota Yamamoto, Kanagawa, JP;
Inventors:
Masayuki Furumiya, Kanagawa, JP;
Ryota Yamamoto, Kanagawa, JP;
Assignee:
NEC Electronics Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer interconnection layer is provided on a semiconductor substrate. An inductor is provided on an insulating layer that forms the uppermost layer of the multilayer interconnection layer. The inductor is formed by spirally arranging a single wiring. On the insulating layer, a multilayer structure body is provided in an inner region of the inductor. In the multilayer structure body, a plurality of ferromagnetic cores formed of Ni are arranged in a matrix. The height of each ferromagnetic core is equal to or larger than the width thereof.