The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
May. 24, 2002
Erik H. Volkerink, San Jose, CA (US);
Ajay Koche, Cupertino, CA (US);
Erik H. Volkerink, San Jose, CA (US);
Ajay Koche, Cupertino, CA (US);
Verigy (Singapore) Pte. Ltd., Singapore, SG;
Abstract
A system and method in which a plurality of dice on a semiconductor wafer are interconnected to enable efficient testing thereof. In certain embodiments a plurality of dice are interconnected in a manner that enables test data to be communicated from a tester system to a plurality of dice for concurrent testing of such plurality of dice. Depending on the amount of interconnection, all or a portion of each of the plurality of dice may be tested concurrently. In certain embodiments, a plurality of dice are interconnected in a manner that enables test data to be communicated from one die to at least one other die. In certain embodiments, a plurality of dice are interconnected in a manner that enables such dice to be tested concurrently while maintaining a repeatable pattern at the reticle level for fabricating such dice.