The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2008
Filed:
Jul. 12, 2005
Keng-chu Lin, Chao-Chou Township, Ping-Tung County, TW;
Chung-chi Ko, Jushan Township, Nantou County, TW;
Yi-chi Liao, Puli Township, Nantou County, TW;
Keng-Chu Lin, Chao-Chou Township, Ping-Tung County, TW;
Chung-Chi Ko, Jushan Township, Nantou County, TW;
Yi-Chi Liao, Puli Township, Nantou County, TW;
Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;
Abstract
A method for forming an interconnect structure. A substrate is provided with a low-k dielectric layer thereon. At least one conductive feature is then formed in the low-k dielectric layer. A cap layer is formed overlying the low-k dielectric layer, and the conductive feature and the low-k dielectric layer is then subjected to an energy source to reduce a dielectric constant thereof.