The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Aug. 26, 2005
Bong Chan Kim, Gangnam-gu, Seoul, KR;
Yoon Joo Kim, Nowon-gu, Seoul, KR;
Youn Sang Kim, Gyeonggi-do, KR;
Bong Chan Kim, Gangnam-gu, Seoul, KR;
Yoon Joo Kim, Nowon-gu, Seoul, KR;
Youn Sang Kim, Gyeonggi-do, KR;
Other;
Abstract
A semiconductor device has a substrate having first, second, and third surfaces. An electrically conductive pattern is formed on the first surface. A semiconductor die has a bond pad formed on a first surface thereof. A second surface of the semiconductor die is coupled to the first surface of the substrate. A first connection member electrically couples the bond pad and the electrically conductive pattern. A first land has a first, second, and third surfaces. The second surface of the first land is coupled to the first electrically conductive pattern. A first encapsulant encapsulates the first semiconductor die, the first connection member, and the first land such that the first surface of the first land is exposed.