The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7408002 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 05, 2008

Filed:

Nov. 13, 2003
Applicants:

Shin Utsunomiya, Miyako, JP;

Seigo Yamada, Ichikawa, JP;

Masahiro Takano, Inba-gun, JP;

Mitsuharu Miyazaki, Inba-gun, JP;

Inventors:

Shin Utsunomiya, Miyako, JP;

Seigo Yamada, Ichikawa, JP;

Masahiro Takano, Inba-gun, JP;

Mitsuharu Miyazaki, Inba-gun, JP;

Assignee:

Toyo Gosei Co., Ltd, Ichikawa-Shi, Chiba, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 299/04 (2006.01); C08L 31/00 (2006.01); C08D 5/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The photosensitive resin composition is composed of a poly((meth)acrylic acid)-based water-soluble photo-sensitive resin (A) having an acid value of 150 mgKOH/g or more on a solid basis; the resin (A) being formed of a ((meth)acrylic acid)-based polymer in which a compound represented by formula (1): (wherein Rrepresents H or Me; and Rrepresents a liner or branched C2-C10 alkylene group) has been added to portions of the carboxylic groups, a photopolymerization initiator (B); and water (C).


Find Patent Forward Citations

Quick Actions:

Utsunomiya, Shin. (2008). Photosensitive resin composition and process for the formation of hydrogel (U.S. Patent No. 7408002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7408002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…