The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2008
Filed:
Dec. 30, 2004
Takaki Kuno, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Yosinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Takaki Kuno, Kyoto, JP;
Keiji Maeda, Kyoto, JP;
Yosinori Noguchi, Kyoto, JP;
Satoshi Kitaoka, Nagoya, JP;
Naoki Kawashima, Nagoya, JP;
Towa Corporation, Kyoto, JP;
Japan Fine Ceramics Center, Nagoya, JP;
Abstract
A composite material used for a resin mold for forming hardened resin by hardening fluid resin is provided. The composite material comprises a first material having excellent wear resistance against the fluid resin and a second material having excellent unwettability against the fluid resin. The resin mold comprises a substrate of the first material, a large number of pores each provided to form an opening on a surface of the substrate opposite to the fluid resin and a film of the second material formed along the inner wall surface of each pore at least around the opening. Each of the large number of pores is a communicating hole connecting the surface opposite to the fluid resin and the remaining surface with each other. Therefore, releasability between a mold surface and the hardened resin and wear resistance of the composite material against the fluid resin can be improved.