The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2008
Filed:
Sep. 13, 2006
Applicants:
Yoshimasa Kawase, Kanagawa-ken, JP;
Hiroshi Itokawa, Kanagawa-ken, JP;
Inventors:
Yoshimasa Kawase, Kanagawa-ken, JP;
Hiroshi Itokawa, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device using a wafer emissivity calculated from a wafer reflectivity to calculate a wafer temperature and to calculate target values for heat source optical intensities provided to a plurality of heat sources which heat the wafer and a substrate peripheral structure.
Kawase, Yoshimasa. (2008). Method and apparatus for manufacturing a semiconductor device (U.S. Patent No. 7402444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7402444
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