The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2008

Filed:

Dec. 01, 2005
Applicants:

Makoto Furuhata, Suwa, JP;

Hisakatsu Sato, Sakata, JP;

Inventors:

Makoto Furuhata, Suwa, JP;

Hisakatsu Sato, Sakata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
Abstract

A surface acoustic wave (SAW) device includes at least an IC region and a SAW element region. A semiconductor element layer and wiring layer is located in the IC region, and the semiconductor element layer has a semiconductor element and an element insulating film. The wiring layer is formed by stacking wiring to connect with the semiconductor element and a wiring insulating film extending to the SAW region. The semiconductor element layer further includes a piezoelectric thin film formed above the wiring insulating film, and in the SAW element region, a SAW element is formed on the piezoelectric thin film equipped with an IDT electrode provided with a plurality of electrode fingers, and at least one layer of layer thickness adjusting films having linear shapes and arranged in parallel to and with the same pitch as the electrode fingers of the IDT electrode.


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