The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2008
Filed:
Jul. 10, 2006
Applicants:
Takashi Kikuchi, Tokyo, JP;
Koichi Kanemoto, Tokyo, JP;
Michiaki Sugiyama, Tokyo, JP;
Hiroshi Kawakukbo, Tokyo, JP;
Inventors:
Takashi Kikuchi, Tokyo, JP;
Koichi Kanemoto, Tokyo, JP;
Michiaki Sugiyama, Tokyo, JP;
Hiroshi Kawakukbo, Tokyo, JP;
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
By preparing a package substrate which has a plurality of lands of NSMD structure, and the output wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is achieved.